Req ID: 135463 Remote Position: No Region: Americas Country: Mexico State/Province: Nuevo Leon City: Monterrey General Overview Functional Area: Engineering Career Stream: Equipment Engineering Manufacturing SAP Short Name: AST-ENG-EQM Job Level: Level 06 IC/MGR: Individual Contributor Direct/Indirect
Link-Worldwide is seeking a skilled Integrated Circuit Package Design Engineer in Mexico, Jalisco. This role involves designing complex packages for high-speed SerDes in cutting-edge technologies such as AI and 5G. You will join a global R&D team to develop high-performance
Global Connect Technologies in Mexico is seeking an experienced Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes and high-power delivery.You will work closely with a worldwide R&D team to develop high-performance designs for ASICs used in AI,
Link-Worldwide is seeking an experienced Integrated Circuit Package Design Engineer located in Mexico, Jalisco, Región Centro. This role involves designing complex flip-chip-BGA packages crucial for high-speed SerDes, collaborating with a global R&D team, and managing projects from concept to manufacturing.The
Link-Worldwide is looking for an experienced Integrated Circuit Package Design Engineer based in Mexico, Sonora. The role involves designing complex flip-chip-BGA packages for high-speed SerDes and collaborating with a worldwide R&D team on cutting-edge ASICs for AI, networking, and 5G.The
Link-Worldwide is looking for an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes. Youll collaborate with a global R&D team to develop high-performance package designs for ASICs in AI, networking, HPC, and 5G.The ideal candidate will have over
Link-Worldwide is seeking an experienced Integrated Circuit Package Design Engineer located in Mexico, Jalisco, Región Centro. This role involves designing complex flip-chip-BGA packages crucial for high-speed SerDes, collaborating with a global R&D team, and managing projects from concept to manufacturing.
Link-Worldwide in Mexico is seeking an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for cutting-edge ASICs. You will work with a worldwide R&D team to innovate designs for AI, networking, HPC, and 5G, applying your extensive experience in high-speed
Link-Worldwide in Mexico is seeking an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for cutting-edge ASICs. You will work with a worldwide R&D team to innovate designs for AI, networking, HPC, and 5G, applying your extensive experience in high-speed
Link-Worldwide in Chihuahua seeks an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes in industry-leading ASICs. The role involves collaborating with an international R&D team to develop innovative designs for artificial intelligence, networking, HPC, and 5G applications.
Job Description : Additional responsibilities: - IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment - System level co-design methodology of IC, Package and PCB/Boar - Concept analysis for new product package selection based on
Senior Principal Digital IC Design Engineer - Digital Compute Team About Us At onsemi , we help improve lives through silicon solutions every day. Our intelligent power and sensing technologies solve the world’s most complex challenges and lead the
Job Detail:- Open to relocation to Dallas, TXQualifications- Mastery of layout and verification tools and methodologies for RF/ Analog/Mixed Signal ICs :- Mastery in Cadence layout (Virtuoso XL) and Calibre verification (ERC, DRC, LVS) required- Able to
Job Detail: - Must be willing to relocate to location within reasonable commuting distance to our offices in Richardson, TX (Hybrid) - Full-Time Qualifications - Mastery of layout and verification tools and methodologies for RF/ Analog/Mixed
# NCG Signal and Power Integrity EngineerTlaquepaque, Jalisco, MexicoApply NowFind out how well you match with this jobJob IDJR97777 Our vision is to transform how the world uses information to enrich life for *all*. Micron Technology
Digital - Oversees definition, design, verification, and documentation for ASIC development for a variety of products. Determines architecture design, logic design, and system simulation. Defines module interfaces/formats for simulation. Evaluates all aspects of the process flow from high-level design to
PHY Design/Integration Engineer Digital - Oversees definition, design, verification, and documentation for ASIC development for a variety of products. Determines architecture design, logic design, and system simulation. Defines module interfaces/formats for simulation. Evaluates all aspects of the process flow from high-level
Our vision is to transform how the world uses information to enrich life for _all_ . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence,
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Company QUALCOMM SEMICONDUCTORES Y SISTEMAS AVANZADOS DE BAJA CALIFORNIA Job Area Engineering Group, Engineering Group Hardware Engineering General Summary This position is for the Post Silicon Engineering group that develops test solutions for highly integrated SOCs