Delivers signal integrity solutions for large, complex highspeed platforms, boards, and packages. - Develops a viable space for all interconnects including 2D and 3D models extracts of electrical structures for the entire die-to-die interconnect. - Defines
Your responsibilities will include but not limited to : - Delivers signal integrity solutions for large, complex highspeed platforms, boards, and packages. - Develops a viable space for all interconnects including 2D and 3D models extracts